Immersion system, exposure apparatus, exposing method, and device fabricating method

ABSTRACT

An immersion system is used in liquid immersion exposure. The immersion system includes: a first member, which is disposed around the optical path of the exposure light and has a first surface that faces in a first direction; a second member that has a liquid recovery port, which is disposed on the outer side of the first surface with respect to the optical path of the exposure light; a first drive apparatus that is capable of moving the first member parallel to the first direction; and a second drive apparatus that is capable of moving the second member parallel to the first direction independently of the first member; wherein, a space between the first surface and a front surface of an object can hold the liquid; and a liquid between the liquid recovery port and the front surface of the object is recovered via the liquid recovery port.

CROSS-REFERENCE TO RELATED APPLICATION

This is a Division of application Ser. No. 12/382,742 filed Mar. 23,2009, which is a non-provisional application claiming priority to andthe benefit of U.S. provisional application No. 61/064,810, filed Mar.27, 2008. The prior applications, including the specifications, drawingsand abstract are incorporated herein by reference in their entirety.

BACKGROUND

1. Field of the Invention

The present invention relates to an immersion system, an exposureapparatus, an exposing method, and a device fabricating method.

2. Description of Related Art

As disclosed in U.S. Patent Application Publication No. 2006/0250593 andU.S. Patent Application Publication No. 2007/0296939, among exposureapparatuses used in photolithography, an immersion exposure apparatus isknown that exposes a substrate with exposure light through a liquid.

In an immersion exposure apparatus, it is critical to satisfactorilyfill the optical path of the exposure light between the substrate and anoptical member, such as a projection optical system, with the liquid. Ifthe optical path cannot be satisfactorily filled with the liquid, forexample, if a gas portion, such as a bubble, occurs in the liquid, thenexposure failures may occur; for example, defects may occur in thepattern formed in the substrate. In addition, if the substrate is movedat high speed in the state wherein the optical path between thesubstrate and, for example, the optical member is filled with theliquid, then it becomes difficult to satisfactorily and continuouslyfill the optical path with the liquid, and the liquid may leak out froma prescribed space, remain on the substrate, or the like. Furthermore,the heat of vaporization of the leaked or residual liquid may inducechanges in the temperature of the optical path, thermal deformation inthe various members, such as the substrate, or the like. In this case,too, exposure failures may occur. As a result, defective devices couldbe produced.

A purpose of some aspects of the present invention is to provide aliquid immersion system that can satisfactorily fill an optical path ofexposure light with a liquid. Another purpose of the aspects of thepresent invention is to provide both an exposure apparatus that canprevent exposure failures and an exposing method. Yet another purpose ofthe aspects of the present invention is to provide a device fabricatingmethod that can prevent the production of defective devices.

SUMMARY

A first aspect of the invention provides an immersion system used in animmersion exposure, comprising: a first member, which is disposed aroundan optical path of exposure light and has a first surface that faces ina first direction, the optical path between an optical member and asubstrate being filled with a liquid, a space between the first surfaceand a front surface of an object being capable of holding a liquid; asecond member that has a liquid recovery port, which is disposed on theouter side of the first surface with respect to the optical path of theexposure light, at least part of a liquid between the liquid recoveryport and the front surface of the object being recovered via the liquidrecovery port; a first drive apparatus that is capable of moving thefirst member in at least the first direction; and a second driveapparatus that is capable of moving the second member in at least thefirst direction independently of the first member.

A second aspect of the invention provides an immersion system used in animmersion exposure, comprising: a first member, which is disposed aroundan optical path of exposure light and has a first surface that faces ina first direction, the optical path between an optical member and asubstrate being filled with a liquid, a space between the first surfaceand a front surface of an object being capable of holding a liquid; asecond member that has a liquid recovery port, which is disposed on theouter side of the first surface with respect to the optical path of theexposure light, at least part of a liquid between the liquid recoveryport and the front surface of the object being recovered via the liquidrecovery port; and a drive apparatus that is capable of controlling arelative movement between a first member and a second member in at leastthe first direction; wherein, the liquid recovery port has a firstrecovery area and a second recovery area, which is disposed on the outerside of the first surface with respect to the optical path of theexposure light, a distance between a front surface of the object and thefirst recovery area in the first direction is greater than a distancebetween the front surface of the object and the second recovery area inthe first direction, and a positional relationship between the firstrecovery area and the first surface in the first direction can beadjusted.

A third aspect of the invention provides an exposure apparatus thatexposes a substrate with exposure light through a liquid, comprising: animmersion system according to the first and second aspects.

A fourth aspect of the invention provides a device fabricating method,comprising: exposing a substrate using an exposure apparatus accordingto the third aspect; and developing the exposed substrate.

A fifth aspect of the invention provides an exposing method that exposesa substrate with exposure light through a liquid, comprising: filling anoptical path of the exposure light between the optical member and thesubstrate with the liquid using an immersion system according to thefirst and second aspects; and radiating the exposure light to thesubstrate through the optical member and the liquid.

A sixth aspect of the invention provides a device fabricating method,comprising: exposing a substrate using an exposing method according tothe fourth aspect; and developing the exposed substrate.

According to some aspects of the present invention, an optical path ofexposure light can be satisfactorily filled with a liquid and therebyprevent exposure failures from occurring and defective devices frombeing produced.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a schematic block diagram that shows one example of anexposure apparatus according to the present embodiment.

FIG. 2 is a side cross sectional view that shows the vicinity of a firstmember and a second member according to the present embodiment.

FIG. 3 is a partial, broken, schematic oblique view of the first memberand the second member according to the present embodiment.

FIG. 4 is an oblique view of the first member and the second memberaccording to the present embodiment, viewed from the lower side.

FIG. 5 is a partial, enlarged, side cross sectional view of the firstmember and the second member according to the present embodiment.

FIG. 6 is a view for explaining one example of the operation of thefirst member and the second member according to the present embodiment.

FIG. 7 is a view for explaining one example of the operation of thefirst member and the second member according to the present embodiment.

FIG. 8 is a view for explaining one example of the operation of thefirst member and the second member according to the present embodiment.

FIG. 9 is a view for explaining one example of the operation of thefirst member and the second member according to the present embodiment.

FIG. 10 is a view for explaining one example of the operation of thefirst member and the second member according to the present embodiment.

FIG. 11 is a flow chart that depicts one example of a process offabricating a microdevice.

DESCRIPTION OF EMBODIMENTS

The following text explains the embodiments of the present inventionreferencing the drawings, but the present invention is not limitedthereto. The explanation below defines an XYZ orthogonal coordinatesystem, and the positional relationships among members are explainedreferencing this system. Prescribed directions within the horizontalplane are the X axial directions, directions orthogonal to the X axialdirections in the horizontal plane are the Y axial directions, anddirections orthogonal to the X axial directions and the Y axialdirections (i.e., the vertical directions) are the Z axial directions.In addition, the rotational (inclination) directions around the X, Y,and Z axes are the θX, θY, and θZ directions, respectively.

FIG. 1 is a schematic block diagram that shows one example of anexposure apparatus EX according to the present embodiment. In FIG. 1,the exposure apparatus EX comprises: a movable mask stage 1, which holdsa mask M; a movable substrate stage 2, which holds a substrate P; anillumination system IL, which illuminates the mask M with exposure lightEL; a projection optical system PL, which projects onto the substrate Pan image of a pattern of the mask M illuminated by the exposure lightEL; and a control apparatus 3, which controls the operation of theentire exposure apparatus EX. In addition, the exposure apparatus EXcomprises an output apparatus 3D, which is connected to the controlapparatus 3 and is capable of outputting, for example, the operationstatus of the exposure apparatus EX. The output apparatus 3D comprisesat least one of the following: a display apparatus, such as a flat paneldisplay; a light generating apparatus that emits light; and a soundgenerating apparatus that emits sound (including alarms).

The mask M may be, for example, a reticle wherein a device pattern isformed that is projected onto the substrate P. The mask M can be, forexample, a light transmissive mask wherein a light shielding film madeof chrome and the like is used to form a prescribed pattern on atransparent plate, such as a glass plate. Furthermore, the mask M canalternatively be a reflective mask. The substrate P is a substrate forfabricating devices. The substrate P comprises a base material (e.g., asemiconductor wafer, such as a silicon wafer) and a photosensitive filmthat is formed thereon. The photosensitive film is made of aphotosensitive material (photoresist). In addition to the photosensitivefilm, the substrate P can include a separate film. For example, thesubstrate P can include an antireflective film, a protective film(topcoat film) that protects the photosensitive film, and the like.

In the present embodiment, the exposure apparatus EX is an immersionexposure apparatus that exposes the substrate P with the exposure lightEL that passes through a liquid LQ. In the present embodiment, animmersion space LS is formed so that at least part of the optical pathof the exposure light EL is filled with the liquid LQ. The immersionspace LS is a space that is filled with the liquid LQ. In the presentembodiment, water (pure water) is used as the liquid LQ.

In the present embodiment, the immersion space LS is formed so that anoptical path K of the exposure light EL that emerges from a last opticalelement 4, which is the optical element of a plurality of opticalelements of the projection optical system PL closest to the image planethereof, is filled with the liquid LQ. The last optical element 4 has anemergent surface 5 that emits the exposure light EL toward the imageplane of the projection optical system PL. The immersion space LS isformed so that the optical path K between the last optical element 4 andan object disposed at a position at which it opposes the emergentsurface 5 of the last optical element 4 is filled with the liquid LQ.The position at which the object opposes the emergent surface 5 includesan irradiation position of the exposure light EL that emerges from theemergent surface 5. In the explanation below, the position at which theobject opposes the emergent surface 5 of the last optical element 4 iscalled an exposure position, where appropriate.

The exposure apparatus EX comprises an immersion system for filling,with the liquid LQ, the optical path K between the last optical element4 and the object disposed at a position at which it opposes the emergentsurface 5 of the last optical element 4. The immersion system comprises:a first member 7, which is disposed around the optical path K of theexposure light EL emitted from the emergent surface 5, that has a lowersurface 6, which is capable of holding the liquid LQ between itself andthe front surface of the object disposed at the exposure position; asecond member 9, which is disposed around the outer side of the lowersurface 6 with respect to the optical path K of the exposure light EL,that has a liquid recovery port 8, which is capable of recovering theliquid LQ on the front surface of the object; a first drive apparatus11, which is capable of moving the first member 7; and a second driveapparatus 12, which is capable of moving the second member 9independently of the first member 7.

The first member 7 is disposed in the vicinity of the last opticalelement 4. In the present embodiment, the object capable of opposing theemergent surface 5 is also capable of opposing the lower surface 6. Whenthe front surface of the object is disposed at a position at which itopposes the emergent surface 5, at least part of the lower surface 6 andthe front surface of the object are opposed. When the emergent surface 5and the front surface of the object are opposed, the space therebetweencan hold the liquid LQ. In addition, when the lower surface 6 and thefront surface of the object are opposed, the space therebetween can holdthe liquid LQ. Holding the liquid LQ between the emergent surface 5 andthe lower surface 6 on one side and the front surface of the object onthe other side forms the immersion space LS so that the optical path Kof the exposure light EL between the emergent surface 5 of the lastoptical element 4 and the front surface of the object is filled with theliquid LQ.

In the present embodiment, the emergent surface 5 faces in the −Zdirection. The lower surface 6 faces in the −Z direction. At least partof the liquid recovery port 8 faces in the −Z direction. At least partof the front surface of the object, which is capable of opposing theemergent surface 5 and the lower surface 6 and of holding the liquid LQbetween itself and the emergent surface 5 and the lower surface 6, facesin the +Z direction.

In the present embodiment, the object, which is capable of opposing theemergent surface 5 and the lower surface 6, can include an object thatis capable of moving on the emergent side (the image plane side) of thelast optical element 4 and an object that is capable of moving within aprescribed surface that includes the exposure position. In the presentembodiment, the object includes either the substrate stage 2 or thesubstrate P, which is held by the substrate stage 2, or both.Furthermore, to simplify the explanation, the following text principallyexplains an exemplary state wherein the substrate P opposes the emergentsurface 5 of the last optical element 4.

The exposure apparatus EX comprises a body 10 that comprises: a firstcolumn 10A, which is provided on a support surface FL inside, forexample, a clean room; and a second column 10B, which is provided on thefirst column 10A. The first column 10A comprises: a plurality of firstsupport posts 13; and a first base plate 15, which is supported by thefirst support posts 13 via vibration isolating apparatuses 14. Thesecond column 10B comprises: a plurality of second support posts 16,which are provided on the first base plate 15, and a second base plate18, which is supported by the second support posts 16 via vibrationisolating apparatuses 17.

The illumination system IL illuminates a prescribed illumination regionIR with the exposure light EL, which has a uniform luminous fluxintensity distribution. The illumination system IL illuminates at leastpart of the mask M disposed in the illumination region IR with theexposure light EL, which has a uniform luminous flux intensitydistribution. Examples of light that can be used as the exposure lightEL emitted from the illumination system IL include: deep ultraviolet(DUV) light such as a bright line (g-line, h-line, or i-line) lightemitted from, for example, a mercury lamp and KrF excimer laser light(with a wavelength of 248 nm); and vacuum ultraviolet (VUV) light suchas ArF excimer laser light (with a wavelength of 193 nm) and F₂ laserlight (with a wavelength of 157 nm). In the present embodiment, ArFexcimer laser light, which is ultraviolet light (vacuum ultravioletlight), is used as the exposure light EL.

The mask stage 1 comprises a mask holding part 1H that releasably holdsthe mask M. In the present embodiment, the mask holding part 1H holdsthe mask M so that a patterned surface (lower surface) of the mask M issubstantially parallel to the XY plane. The mask stage 1, in the statewherein it holds the mask M, is capable of moving, by the operation of afirst drive system ID that includes actuators (e.g., linear motors),along an upper surface (a guide surface) of the second base plate 18within an XY plane that includes the illumination region IR. The uppersurface of the second base plate 18 is substantially parallel to the XYplane. In the present embodiment, in the state wherein the mask M isheld by the mask holding part 111, the mask stage 1 is capable of movingin three directions: the X axial, Y axial, and θZ directions.

A laser interferometer 19A of the interferometer system 19 measures theposition of the mask stage 1 (mask M). The laser interferometer 19Ameasures the position using a reflecting mirror 1R, which is provided tothe mask stage 1. Based on the measurement result of the laserinterferometer 19A, the control apparatus 3 controls the position of themask M, which is held by the mask stage 1, by operating the first drivesystem 1D.

The projection optical system PL radiates the exposure light EL to aprescribed projection region PR. The projection optical system PLprojects with a prescribed projection magnification an image of thepattern of the mask M to at least part of the substrate P, which isdisposed in the projection region PR. A lens barrel 20 holds theplurality of optical elements of the projection optical system PL. Thelens barrel 20 has a flange 20F. The projection optical system PL issupported by the first base plate 15 via the flange 20F. The position ofthe projection optical system PL, which is supported by the first baseplate 15 and comprises the last optical element 4, is substantiallyfixed. Furthermore, a vibration isolating apparatus can be providedbetween the first base plate 15 and the lens barrel 20. The projectionoptical system PL of the present embodiment is a reduction system thathas a projection magnification of, for example, ¼, ⅕, or ⅛. Furthermore,the projection optical system PL may also be a unity magnificationsystem or an enlargement system. In the present embodiment, an opticalaxis AX of the projection optical system PL is parallel to the Z axis.In addition, the projection optical system PL may be a dioptric systemthat does not include catoptric elements, a catoptric system that doesnot include dioptric elements, or a catadioptric system that includesboth catoptric and dioptric elements. In addition, the projectionoptical system PL may form either an inverted or an erect image.

The substrate stage 2 comprises a substrate holding part 2H, whichreleasably holds the substrate P. In the present embodiment, thesubstrate holding part 2H holds the substrate P so that the frontsurface (exposure surface) of the substrate P is substantially parallelto the XY plane. The substrate stage 2, in the state wherein it holdsthe substrate P, is capable of moving, by the operation of a seconddrive system 2D that comprises actuators (e.g., linear motors), along anupper surface (a guide surface) of a third base plate 21 within an XYplane that includes the projection region PR. The third base plate 21 issupported by the support surface FL via vibration isolating apparatuses22. The upper surface of the third base plate 21 is substantiallyparallel to the XY plane. In the present embodiment, in the statewherein the substrate P is held by the substrate holding part 2H, thesubstrate stage 2 is capable of moving in six directions: the X, Y, andZ axial directions, and the θX, θY, and θZ directions.

The substrate stage 2 has an upper surface 2T, which is disposed aroundthe substrate holding part 2H and is capable of opposing the emergentsurface 5 of the last optical element 4. The substrate holding part 2His disposed in a recessed part 2C, which is provided in the substratestage 2. The front surface of the substrate P held by the substrateholding part 2H is capable of opposing the emergent surface 5 of thelast optical element 4. The upper surface 2T of the substrate stage 2 isa flat surface that is substantially parallel to the XY plane. The frontsurface of the substrate P, which is held by the substrate holding part211, and the upper surface 2T of the substrate stage 2 are disposed insubstantially the same plane (i.e., they are substantially flush withone another).

A Laser interferometer 19B of the interferometer system 19 measures theposition of the substrate stage 2 (the substrate P) in the X axial, Yaxial, and θZ directions. The laser interferometer 19B measures theposition of the substrate stage 2 using a reflecting mirror 2R, which isprovided to the substrate stage 2. In addition, a detection system 50detects the position (in the Z axial, θX, and θY directions) of a frontsurface of the substrate P held by the substrate stage 2. Based on themeasurement result of the laser interferometer 19B and the detectionresults of the detection system 50, the control apparatus 3 controls theposition of the substrate P held by the substrate stage 2 by operatingthe second drive system 2D.

In the present embodiment, the detection system 50 is capable ofdetecting the height (position in the Z axial directions) of the frontsurface of the substrate P or the upper surface 2T of the substratestage 2, or both, at a plurality of detection points. The detectionsystem 50 can detect not only the front surface of the substrate P andthe upper surface 2T of the substrate stage 2, but also the position ofthe front surface of the object. Furthermore, various sensors can beemployed in the detection system 50. For example, detection light may beradiated to the front surface of the substrate P or the upper surface 2Tof the substrate stage 2, or to both, and an optical sensor thatreceives the reflected light thereof may be employed; alternatively, acapacitance sensor may be employed.

In the present embodiment, the exposure apparatus EX is a scanning typeexposure apparatus (a so-called scanning stepper) that projects theimage of the pattern of the mask M to the substrate P whilesynchronously moving the mask M and the substrate P in prescribedscanning directions. When the substrate P is to be exposed, the controlapparatus 3 controls the mask stage 1 and the substrate stage 2 so as tomove the mask M and the substrate P, respectively, in the prescribedscanning directions within the XY plane, which is orthogonal to theoptical axis AX (i.e., the optical path K of the exposure light EL). Inthe present embodiment, the scanning directions (the synchronousmovement directions) of both the substrate P and the mask M are the Yaxial directions. The control apparatus 3 moves the substrate P in oneof the Y axial directions with respect to the projection region PR ofthe projection optical system PL and radiates the exposure light EL tothe substrate P through the projection optical system PL and the liquidLQ in the immersion space LS on the substrate P while moving,synchronized to the movement of the substrate P, the mask M in the otherY axial direction with respect to the illumination region IR of theillumination system IL. Thereby, the image of the pattern of the mask Mis projected to the substrate P, which is thereby exposed by theexposure light EL.

The first member 7 and the second member 9 of the liquid immersionsystem will now be explained, referencing FIG. 2 through FIG. 5. FIG. 2is a side cross sectional view that shows the vicinity of the firstmember 7 and the second member 9; FIG. 3 is a schematic, oblique,partial, broken view that shows the first member 7 and the second member9; FIG. 4 is an oblique view, viewed from the lower side, of the firstmember 7 and the second member 9; and FIG. 5 is a partial, enlarged,side cross sectional view of the first member 7 and the second member 9.

Furthermore, the following text explains an exemplary case wherein thesubstrate P is disposed at a position at which it opposes the emergentsurface 5 of the last optical element 4; however, as discussed above, itis also possible to dispose an object other than the substrate P, suchas the substrate stage 2, at a position at which it opposes the emergentsurface 5 of the last optical element 4.

The first member 7 is a rectangular annular member (rectangular ringshaped member). The first member 7 is disposed around the optical path Kof the exposure light EL. In the present embodiment, the first member 7comprises a side plate part 23, which is disposed around the lastoptical element 4, and a lower plate part 24, at least part of which isdisposed between the emergent surface 5 of the last optical element 4and the front surface of the substrate P in the Z axial directions.

The side plate part 23 opposes an outer circumferential surface 25 ofthe last optical element 4 and has an inner circumferential surface 26that is formed along that outer circumferential surface 25. The innercircumferential surface 26 of the first member 7 is disposed so that itopposes the outer circumferential surface 25 of the last optical element4 with a prescribed gap G1 interposed therebetween. In addition, theouter circumferential surface 25 and the inner circumferential surface26 are inclined upward in a radial direction with respect to the opticalaxis AX (i.e., the optical path K of the exposure light EL). Namely, theouter circumferential surface 25 and the inner circumferential surface26 are each provided so that its distance from the front surface of thesubstrate P gradually increases as it becomes more spaced apart from theoptical axis AX. The outer circumferential surface 25 and the innercircumferential surface have each an upward and outward inclination. Inthe present embodiment, the size of the gap G1 is such that at leastpart of the liquid LQ of the immersion space LS can flow into the gapG1. The outer circumferential surface 25 and the inner circumferentialsurface 26 may be parallel to the optical axis AX.

The lower plate part 24 has an opening 27 at its center. The exposurelight EL that emerges from the emergent surface 5 of the last opticalelement 4 can pass through the opening 27. For example, during anexposure of the substrate P, the exposure light EL that emerges from theemergent surface 5 of the last optical element 4 passes through theopening 27 and is radiated to the front surface of the substrate Pthrough the liquid LQ. In the present embodiment, the cross sectionalshape of the exposure light EL in the opening 27 is substantiallyrectangular (slit shaped) with the longitudinal directions in the Xaxial directions. In accordance with the cross sectional shape of theexposure light EL, the opening 27 is formed in a substantiallyrectangular shape (a slit shape) in the X and Y directions. In addition,the cross sectional shape of the exposure light EL in the opening 27 andthe shape of the projection region PR of the projection optical systemPL on the substrate P are substantially similar.

The first member 7 has a lower surface 6, which is disposed around theoptical path K of the exposure light EL and faces in the −Z direction.The lower surface 6 is disposed so that it opposes the front surface ofthe substrate P. The lower surface 6 is capable of holding the liquid LQbetween itself and the front surface of the substrate P. In the presentembodiment, the lower surface 6 is flat and substantially parallel tothe front surface of the substrate P (the XY plane). In the presentembodiment, the external shape of the lower surface 6 within the XYplane is rectangular. In the present embodiment, the lower surface 6 maybe inclined with respect to the XY plane, may be a curved surface, orthe like.

In the present embodiment, the lower surface 6 includes the lowersurface of the lower plate part 24. The lower surface 6 is disposedaround the opening 27. When the substrate P is disposed at a position atwhich it opposes the lower surface 6 of the first member 7, the firstmember 7 can hold the liquid LQ between at least the lower surface 6 andthe front surface of the substrate P.

The second member 9 is a rectangular annular member. The second member 9is disposed around the optical path K of the exposure light EL. In thepresent embodiment, the second member 9 is disposed around the firstmember 7. The second member 9 has an inner circumferential surface 29,which opposes part of an outer circumferential surface 28 of the firstmember 7 and is formed along that outer circumferential surface 28. Agap G2 is formed between the inner circumferential surface 29 of thesecond member 9 and the outer circumferential surface 28 of the firstmember 7. In addition, the outer circumferential surface 28 and theinner circumferential surface 29 are each inclined upward in a radialdirection with respect to the optical axis AX (i.e., the optical path Kof the exposure light EL). Namely, the outer circumferential surface 28and the inner circumferential surface 29 are each provided so that itsdistance from the front surface of the substrate P gradually increasesas it becomes more spaced apart from the optical axis AX. The outercircumferential surface 28 and the inner circumferential surface 29 haveeach an upward and outward inclination. In the present embodiment, thesize of the gap G2 is such that at least part of the liquid LQ of theimmersion space LS can flow into the gap G2. Furthermore, the size ofthe gap G2 may be such that the penetration of the liquid LQ into theimmersion space LS owing to the surface tension of the liquid LQ isprevented. The outer circumferential surface 28 and the innercircumferential surface 29 may be parallel to the optical axis AX.

The second member 9 has a liquid recovery port 8, which is disposed onthe outer side of the lower surface 6 with respect to the optical path Kof the exposure light EL, at least part of which faces in the direction.In FIG. 5, the liquid recovery port 8 opposes the front surface of thesubstrate P. In the present embodiment, the liquid recovery port 8 isdisposed around the optical path K of the exposure light EL. The liquidrecovery port 8 is capable of recovering the liquid LQ that is on thesubstrate P. At least part of the liquid LQ between the liquid recoveryport 8 and the front surface of the substrate P opposed thereto isrecovered via the liquid recovery port 8.

In the present embodiment, the liquid recovery port 8 has a liquidrecovery surface 30, at least part of which faces in the Z direction. Inthe present embodiment, a porous member 34 is disposed in the liquidrecovery port 8, and the front surface of the porous member 34 forms theliquid recovery surface 30. The liquid immersion surface 30 is disposedaround the optical path K of the exposure light EL. In the presentembodiment, the porous member 34 is a plate shaped member, and theliquid recovery surface 30 is formed from one porous member 34 (a singlesheet thereof). In the present embodiment, the porous member 34 has bentportions. Furthermore, in the present embodiment, the porous member 34is one wherein a plurality of holes (through holes) are formed in aplate; however, a sintered member (e.g., sintered metal) wherein aplurality of holes (pores) are formed, a foam member (e.g., metal foam),or the like can also be used as the porous member 34.

The liquid recovery surface 30 is disposed on the outer sides of thelower surface 6 with respect to the optical path K of the exposure lightEL. The liquid recovery surface 30 is capable of recovering the liquidLQ between the liquid immersion member 30 and the front surface of thesubstrate P. At least part of the liquid LQ between the liquid recoverysurface 30 (i.e., the liquid recovery port 8) and the front surface ofthe substrate P, which opposes the liquid recovery surface 30, isrecovered via the porous member 34. The liquid recovery surface 30 iscapable of recovering the liquid LQ that contacts the recovery surface30 (i.e., at the front surface of the porous member 34).

The liquid recovery surface 30 has: a first liquid recovery surface 31,which is disposed around the lower surface 6 and faces in the −Zdirection; a second liquid recovery surface 32, which is disposed aroundthe first liquid recovery surface 31 and faces in a direction other thanthe −Z direction; and a third liquid recovery surface 33, which isdisposed around the second liquid recovery surface 32 and faces in the−Z direction. The first, second, and third liquid recovery surfaces 31,32, 33 each include the front surface of the porous member 34.Furthermore, an area between the first liquid recovery surface 31 andthe third liquid recovery surface 33 (i.e., the area wherein the secondliquid recovery surface 32 is formed) may serve as a non-liquid recoverysurface that does not recover the liquid LQ.

In the present embodiment, the first liquid recovery surface 31 and thethird liquid recovery surface 33 are substantially parallel to the lowersurface 6. Namely, the first liquid recovery surface 31 and the thirdliquid recovery surface 33 are substantially parallel to the frontsurface of the substrate P (the XY plane). In addition, as shown in FIG.5, in the present embodiment, a distance B1 between the first liquidrecovery surface 31 and the front surface of the substrate P in the Zaxial directions is larger than a distance B2 between the third liquidrecovery surface 33 and the front surface of the substrate P in the Zaxial directions. In addition, in the present embodiment, the secondliquid recovery surface 32 is inclined downward in radial directionswith respect to the optical axis AX (i.e., the optical path K of theexposure light EL). Namely, the second liquid recovery surface 32 isprovided so that the spacing between it and the front surface of thesubstrate P becomes gradually smaller as the second liquid recoverysurface 32 becomes more spaced apart from the optical axis AX. Thesecond liquid recovery surface 32 has an outward declination (downwardand outward inclination). In addition, a distance A between the lowersurface 6 and the front surface of the substrate P is smaller than adistance E between the emergent surface 5 and the front surface of thesubstrate P.

In FIG. 5, the distance A between the lower surface 6 and the frontsurface of the substrate P in the Z axial directions is smaller than thedistance B1 between the first liquid recovery surface 31 and the frontsurface of the substrate P in the Z axial directions. Thus, if the firstliquid recovery surface 31 is spaced apart from the lower surface 6 withrespect to the front surface of the substrate P, then a step 35 isformed between the lower surface 6 and the first liquid recovery surface31. The step 35 is formed on the outer sides of the first member 7 withrespect to the optical path K of the exposure light EL. Accordingly, arecessed part 36, which is recessed in the +Z direction with respect tothe front surface of the substrate P, is formed on the outer sides ofthe lower surface 6 with respect to the optical path K of the exposurelight EL. The recessed part 36 is defined by part of the outercircumferential surface 28, the first liquid recovery surface 31, andthe second liquid recovery surface 32.

The first drive apparatus 11 is capable of driving the first member 7parallel to (or along or in) at least the Z axial directions. In theembodiment, along with the movement of the first member 7 in the Z axialdirections, the lower surface 6 of the first member 7 moves in the Zaxial directions. In another embodiment, the lower surface 6 of thefirst member 7 can move in the Z axial directions, along with a movementof the first member 7 in other than the Z axial directions, along with asubstantially rotation of the first member 7, or along with adeformation of the first member 7. As shown in FIG. 2, in the presentembodiment, the first drive apparatus 11 comprises: drive mechanisms11A, which are disposed on the first base plate 15 (the first column10A), that comprise actuators, for example, voice coil motors; andconnecting members 11 B, each of which connects its corresponding drivemechanism 11A to the first member 7. The control apparatus 3 is capableof moving the first member 7, which is connected to the connectingmembers 11B, in both the +Z and −Z directions by operating the drivemechanisms 11A.

The second drive apparatus 12 is capable of driving the second member 9parallel to (or along or in) at least the Z axial directionsindependently of the first member 7. In the embodiment, along with themovement of the second member 9 in the Z axial directions, the liquidrecovery port 8 (i.e., the liquid recovery surface 30) moves in the Zaxial directions. In another embodiment, the liquid recovery port 8(i.e., the liquid recovery surface 30) can move in the Z axialdirections, along with a movement of the second member 9 in other thanthe Z axial directions, along with a substantially rotation of thesecond member 9, or along with a deformation of the second member 9. Inthe present embodiment, the second drive apparatus 12 comprises: a drivemechanism 12A, which is disposed in the first base plate 15 (the firstcolumn 10A), that comprises actuators, such as voice coil motors; and aconnecting member 12B that connects the drive mechanism 12A and thesecond member 9. The control apparatus 3 is capable of moving the secondmember 9, which is connected to the connecting member 12B, in both the+Z and −Z directions by operating the drive mechanism 12A.

The control apparatus 3 is capable of controlling the first driveapparatus 11 and the second drive apparatus 12. The control apparatus 3can move the lower surface 6 and the liquid recovery port 8 (i.e., theliquid recovery surface 30) relative to one another in the Z axialdirections by operating at least one of the following: the first driveapparatus 11 and the second drive apparatus 12.

The control apparatus 3 can adjust the positional relationship betweenthe lower surface 6 and the front surface of the substrate P in the Zaxial directions by operating the first drive apparatus 11 and canadjust the positional relationship between the liquid recovery port 8(i.e., the liquid recovery surface 30) and the front surface of thesubstrate P in the Z axial directions by operating the second driveapparatus 12. The adjustment of the positional relationship between thelower surface 6 and the front surface of the substrate P in the Z axialdirections includes the adjustment of the distance A between the lowersurface 6 and the front surface of the substrate P in the Z axialdirections. In addition, the adjustment of the positional relationshipbetween the liquid recovery port 8 (i.e., the liquid recovery surface30) and the front surface of the substrate P in the Z axial directionsincludes the adjustment of a distance B between the liquid recovery port8 (i.e., the liquid recovery surface 30) and the front surface of thesubstrate P in the Z axial directions. The adjustment of the distance Bbetween the liquid recovery port 8 (i.e., the liquid recovery surface30) and the front surface of the substrate P in the Z axial directionsincludes at least one of the following: the adjustment of the distanceB1 between the first liquid recovery surface 31 and the front surface ofthe substrate P in the Z axial directions; and the adjustment of thedistance B2 between the third liquid recovery surface 33 and the frontsurface of the substrate P in the Z axial directions.

In addition, the control apparatus 3 can adjust the positionalrelationship between the emergent surface 5 and the lower surface 6 inthe Z axial directions by operating the first drive apparatus 11 and canadjust the positional relationship between the emergent surface 5 andthe liquid recovery port 8 (i.e., the liquid recovery surface 30) in theZ axial directions by operating the second drive apparatus 12. Theadjustment of the positional relationship between the emergent surface 5and the lower surface 6 in the Z axial directions includes theadjustment of a distance C between the emergent surface 5 and the lowersurface 6 in the Z axial directions. The adjustment of the positionalrelationship between the emergent surface 5 and the liquid recovery port8 (i.e., the liquid recovery surface 30) in the Z axial directionsincludes the adjustment of a distance D between the emergent surface 5and the liquid recovery port 8 (i.e., the liquid recovery surface 30) inthe Z axial directions. In the present embodiment, the distance Dincludes, in the Z axial directions, the distance D1 between theemergent surface 5 and the first liquid recovery surface 31 and adistance D2 between the emergent surface 5 and the third liquid recoverysurface 33.

In the present embodiment, the adjustment of the distance C between theemergent surface 5 and the lower surface 6 in the Z axial directionsincludes the adjustment of the distance A between the lower surface 6and the front surface of the substrate P in the Z axial directions. Inaddition, the adjustment of the distance D between the emergent surface5 and the liquid recovery port 8 (i.e., the liquid recovery surface 30)in the Z axial directions includes the adjustment of the distance 13between the liquid recovery port 8 (i.e., the liquid recovery surface30) and the front surface of the substrate P in the Z axial directions.As discussed above, the position of the last optical element 4 of theprojection optical system PL supported by the first base plate 15 issubstantially fixed. In addition, during, for example, the normaloperation of exposing the substrate P, the front surface (the exposuresurface) of the substrate P might be moved in the Z axial, θX, and θYdirections so that it has a prescribed positional relationship with(i.e., coincides with) the image plane of the projection optical systemPL; however, that amount of movement is extremely small. Namely, duringthe normal operation of exposing the substrate P, the distance E betweenthe emergent surface 5 and the front surface of the substrate P in the Zaxial directions is substantially determined in advance, and the amountof change in the distance E is extremely small. Accordingly, in thepresent embodiment, the adjustment of the distance C between theemergent surface 5 and the lower surface 6 is substantially equal to theadjustment of the distance A between the lower surface 6 and the frontsurface of the substrate P; furthermore, the adjustment of the distanceD between the emergent surface 5 and the liquid recovery port 8 (i.e.,the liquid recovery surface 30) is substantially equal to the adjustmentof the distance B between the liquid recovery port 8 (i.e., the liquidrecovery surface 30) and the front surface of the substrate P.

Thus, in the present embodiment, the control apparatus 3 can adjust thedistance A between the lower surface 6 and the front surface of thesubstrate P by adjusting the distance C between the emergent surface 5and the lower surface 6, and can adjust the distance B between theliquid recovery port 8 (i.e., the liquid recovery surface 30) and thefront surface of the substrate P by adjusting the distance D between theemergent surface 5 and the liquid recovery port 8 (i.e., the liquidrecovery surface 30).

In addition, the control apparatus 3 can adjust the positionalrelationship between the lower surface 6 of the first member 7 and thefirst liquid recovery surface 31 of the second member 9 by operating atleast one of the following: the first drive apparatus 11 and the seconddrive apparatus 12. The adjustment of the positional relationshipbetween the lower surface 6 and the first liquid recovery surface 31 inthe Z axial directions includes the adjustment of a distance F (the sizeof the step 35) between the lower surface 6 and the first liquidrecovery surface 31 in the Z axial directions.

In the state shown in FIG. 5, the distance C is different from thedistance D1 but is equal to the distance D2.

Furthermore, in the present embodiment, as shown in FIG. 5, the frontsurface of the object (here, the substrate P) is disposed so that it issubstantially parallel to the XY plane and substantially coincides withthe image plane of the projection optical system PL; furthermore, theinitial state is the state wherein the distance A and the distance B2are equal and the distance A and the distance C are equal. Whereappropriate in the explanation below, in the initial state shown in FIG.5, the distance A is called an initial distance A₀, the distance 13 iscalled an initial distance B₀ (wherein the distance B1 is called aninitial distance B1 ₀ and the distance B2 is called an initial distanceB2 ₀), the distance C is called an initial distance C₀, the distance Dis called an initial distance D₀ (wherein the distance D1 is called aninitial distance D1 ₀ and the distance D2 is called an initial distanceD2 ₀), the distance E is called an initial distance E₀, and the distanceF is called an initial distance F₀.

In the present embodiment, the first member 7 has liquid supply ports37, which supply the liquid LQ to the optical path K of the exposurelight EL. The liquid supply ports 37 are disposed in the vicinity of theoptical path K and are capable of supplying the liquid LQ to the opticalpath K. To form the immersion space LS, the liquid supply ports 37 arecapable of supplying the liquid LQ to the space between the emergentsurface 5 and the lower surface 6 on one side and the front surface ofthe substrate P on the other side.

In the present embodiment, the liquid supply ports 37 each face adirection other than the −Z direction. The liquid supply ports 37 aredisposed in the first member 7 in the vicinity of the optical path K ofthe exposure light EL so that they face the optical path K.

In the present embodiment, the first member 7 is disposed around theoptical path K of the exposure light EL and has an upper surface 38 thatopposes the emergent surface 5 with a prescribed gap G3 interposedtherebetween. In the present embodiment, the upper surface 38 includesthe upper surface of the lower plate part 24. The upper surface 38 isflat and is substantially parallel to the XY plane. The upper surface 38is disposed around the opening 27. The liquid supply ports 37 arecapable of supplying the liquid LQ to a space 39 between the emergentsurface 5 and the upper surface 38. In the present embodiment, theliquid supply ports 37 are disposed on opposite sides of the opticalpath K in the Y axial directions (one on each side). In the explanationbelow, the space 39 is called the internal space 39 where appropriate.

As shown in FIG. 2, the liquid supply ports 37 are connected to a liquidsupply apparatus 41 via passageways 40. The liquid supply apparatus 41comprises a temperature adjusting apparatus and a flow controlapparatus, which is called a mass flow controller; furthermore, theliquid supply apparatus 41 is capable of feeding a prescribed amount perunit of time of the liquid LQ, which is pure and temperature adjusted.The liquid supply apparatus 41 is capable of controlling the amount ofthe liquid LQ supplied per unit of time. Each passageway 40 comprises asupply passageway 40A, which is formed inside the first member 7, and apassageway 40B, which is formed from a supply pipe that connects thesupply passageway 40A and the liquid supply apparatus 41. The liquid LQthat is fed from the liquid supply apparatus 41 is supplied to each ofthe supply ports 37 through the corresponding passageway 40. The supplyports 37 supply the liquid LQ from the liquid supply apparatus 41 to theoptical path K.

The liquid recovery port 8 is connected to a liquid recovery apparatus43 via a passageway 42. The liquid recovery apparatus 43 is capable ofrecovering the liquid LQ by suctioning the liquid LQ using a vacuumsystem. The liquid recovery apparatus 43 can control the amount of theliquid LQ recovered per unit of time. The passageway 42 comprises arecovery passageway 42A, which is formed inside the second member 9, anda passageway 42B, which is formed from a recovery pipe that connects therecovery passageway 42A and the liquid recovery apparatus 43. In thepresent embodiment, the control apparatus 3 recovers the liquid LQ viathe porous member 34 (i.e., the liquid recovery surface 30) by operatingthe liquid recovery apparatus 43 to create a pressure differentialbetween the upper surface and the lower surface of the porous member 34.The liquid LQ that is recovered from the liquid recovery surface 30 isrecovered by the liquid recovery apparatus 43 through the passageway 42.

The control apparatus 3 controls the operation of the liquid supplyapparatus 41 and the liquid recovery apparatus 43. The control apparatus3 is capable of adjusting the amount of the liquid LQ supplied per unitof time via the liquid supply ports 37 by controlling the liquid supplyapparatus 41. In addition, the control apparatus 3 is capable ofadjusting the amount of the liquid LQ recovered per unit of time fromthe liquid recovery port 8 by controlling the liquid recovery apparatus43.

In the present embodiment, the control apparatus 3 can set the liquidsupply apparatus 41 to at least one of the following modes: a first modethat sets the amount of the liquid LQ supplied per unit of time from theliquid supply ports 37 to a first amount that is less than theprescribed amount to be supplied; and a second mode that sets such to asecond amount that is greater than the prescribed amount to be supplied.Furthermore, a configuration may be adopted such that the amount of theliquid LQ supplied can be set flexibly.

In the present embodiment, the control apparatus 3 selects either thefirst mode or the second mode in accordance with contact angleinformation (e.g., receding contact angle and hysteresis) of the liquidLQ at the front surface of the object that opposes the emergent surface5. For example, the control apparatus 3 selects either the first mode orthe second mode in accordance with the contact angle of the liquid LQ atthe front surface of the substrate P held by the substrate stage 2. Inthe present embodiment, the control apparatus 3 selects the first modeif the receding contact angle of the liquid LQ at the front surface ofthe substrate P is relatively large (e.g., if the receding contact angleis 80° or greater) and selects the second mode if the receding contactangle of the liquid LQ is relatively small (e.g., if the recedingcontact angle is less than 80°).

Furthermore, the first mode or the second mode may be selected based oninformation other than the contact angle information discussed above ormay be selected based on both the contact angle information discussedabove and other information.

It may be necessary to consider, for example, the force (pressure) thatthe liquid LQ exerts upon the last optical element 4 and/or thesubstrate stage 2 (the substrate P), changes in the temperature of theliquid LQ, and the like. Ensuring that the amount of the liquid LQsupplied per unit of time from the liquid supply ports 37 is on thesmall side can reduce the force (pressure) of the liquid LQ that acts onthe last optical element 4. In addition, ensuring that the amount of theliquid LQ supplied per unit of time from the liquid supply ports 37 ison the small side also can reduce the force (pressure) of the liquid LQthat acts on the substrate P or the substrate stage 2. Moreover, if theamount of the liquid LQ supplied per unit of time from the liquid supplyports 37 is small, then flow of the liquid LQ will be small, andconsequently temperature changes (a temperature distribution) in theliquid LQ owing to, for example, irradiation by the exposure light ELwill tend to occur.

Ensuring that the amount of the liquid LQ supplied per unit of time fromthe liquid supply ports 37 is on the large side can prevent temperaturechanges (a temperature distribution) in the liquid LQ owing to, forexample, irradiation by the exposure light EL. Moreover, if the amountof the liquid LQ supplied per unit of time from the liquid supply ports37 is large, then there is a possibility that the force (pressure)exerted by the liquid LQ on the last optical element 4 and the substratestage 2 (the substrate P) will increase.

As shown in FIG. 3, in the present embodiment, the first member 7 hasexhaust ports 45, which bring the internal space 39 and an externalspace 44 (i.e., the ambient environment) surrounding the first member 7(i.e., the immersion space LS) into communication. The exhaust ports 45are disposed in the vicinity of the internal space 39 and are capable ofexhausting the gas therein. In the present embodiment, the exhaust ports45 are provided on opposite sides (one on each side) of the optical pathK in the X axial directions. The exhaust ports 45 are connected toexhaust passageways 46, which are formed inside the first member 7. Theopenings 47 at the upper ends of the exhaust passageways 46 are disposedat positions at which they can contact the gas in the external space 44.The gas in the external space 44 can flow into the internal space 39 viathe exhaust passageways 46, and the gas in the internal space 39 canflow out to the external space 44 via the exhaust passageways 46. In thepresent embodiment, the gas can flow continuously back and forth betweenthe internal space 39 and the external space 44 (i.e., the atmosphericspace), which is outside of the internal space 39, via the exhaustpassageways 46, and the internal space 39 is open to the atmosphere viathe same.

In the present embodiment, the lower surface 6 of the first member 7 islyophilic with respect to the liquid LQ. For example, the contact anglebetween the lower surface 6 and the liquid LQ is less than 40°, and ispreferably less than 20°. The lower surface 6 is lyophilic with respectto the liquid LQ, and therefore can maintain contact with the liquid LQof the immersion space LS even if the substrate P is moved in the X andY directions. The lower surface 6 maintains contact with the liquid LQof the immersion space LS during at least the exposure of the substrateP. Furthermore, there is no need for the entire lower surface 6 tomaintain contact with the liquid LQ; however, to maintain the statewherein the optical path K is filled with the liquid LQ, at least partof the lower surface 6 should maintain contact with the liquid LQ.

In addition, in the present embodiment, the emergent surface 5 and thelower surface 6 can hold the liquid LQ between themselves and the frontsurface of the substrate P; furthermore, at least part of the liquidrecovery surface 30 can hold the liquid LQ between itself and the frontsurface of the substrate P. FIG. 2 and FIG. 5 show a state wherein partof the liquid LQ on the substrate P is held between the substrate P onone side and the lower surface 6 and part of the area of the liquidrecovery surface 30 on the other side. For example, during an exposureof the substrate P, the immersion space LS is formed by the holding ofthe liquid LQ between the lower surface 6 and the liquid recoverysurface 30 on one side and the front surface of the substrate P on theother side.

In the present embodiment, the immersion space LS is formed so that partof the area (a local area) of the front surface of the substrate P,which is disposed at a position at which it opposes the emergent surface5 and the lower surface 6, is covered by the liquid LQ, and an interface(i.e., meniscus or edge) LG of the liquid LQ in the immersion space LSis formed between at least the front surface of the substrate P and theliquid recovery surface 30. Namely, the exposure apparatus EX of thepresent embodiment adopts a local liquid immersion system wherein theimmersion space LS is formed so that the part of the area on thesubstrate P that includes the projection region PR of the projectionoptical system PL is covered with the liquid LQ during the exposure ofthe substrate P.

The following text explains a method of using the exposure apparatus EXthat has the abovementioned configuration to perform an immersionexposure on the substrate P.

The control apparatus 3 supplies the liquid LQ from the liquid supplyports 37 to the optical path K. The liquid LQ that is fed from theliquid supply apparatus 41 is supplied to each liquid supply port 37through the corresponding passageway 40. The liquid supply ports 37supply the liquid LQ to the internal space 39. The liquid LQ flowsthrough the internal space 39 and the opening 27 into the space betweenthe lower surface 6 and the front surface of the substrate P. Inaddition, at least part of the liquid LQ flows into the space betweenthe liquid recovery surface 30 and the front surface of the substrate P.

In addition, in the present embodiment, the control apparatus 3 performsthe liquid recovery operation, wherein the liquid recovery port 8 (i.e.,the liquid recovery surface 30) is used, in parallel with performing theliquid supply operation, wherein the liquid supply ports 37 are used. Atleast part of the liquid LQ that contacts the liquid recovery surface 30is recovered through the porous member 34, which forms the liquidrecovery surface 30. Thereby, the immersion space LS is formed so thatthe optical path K between the emergent surface 5 of the last opticalelement 4 and the front surface of the substrate P is filled with thefirst liquid LQ.

In the state wherein the immersion space LS has been formed, the controlapparatus 3 starts the exposure of the substrate P. A plurality of shotregions, which are exposure target areas, are disposed as a matrix onthe substrate P. To expose a first shot region on the substrate P, thecontrol apparatus 3 exposes the first shot region through the projectionoptical system PL and the liquid LQ on the substrate P while moving thefront surface of the substrate P (the first shot region) in the Y axialdirections with respect to the last optical element 4. To start theexposure of a second shot region after the exposure of the first shotregion on the substrate P is complete, the control apparatus 3 performsan operation (stepping operation) wherein the front surface of thesubstrate P is moved in one of the X axial directions (or in a directionthat is inclined with respect to the X axial directions within the XYplane) in a state wherein the immersion space LS is formed and thenmoves a second shot region to the exposure start position. Furthermore,the control apparatus 3 starts the exposure of the second shot region.

The control apparatus 3 sequentially exposes a plurality of shot regionson the substrate P by repetitively performing: a scanning exposureoperation that exposes the current shot region while moving that shotregion in the Y axial directions with respect to the last opticalelement 4; and a stepping operation that, after the exposure of thecurrent shot region is complete, moves the next shot region to theexposure start position.

In the present embodiment, the temperature of the liquid LQ is monitoredduring the exposures of the plurality of shot regions on the substrateP. In the present embodiment, a temperature sensor capable of detectingthe temperature of the liquid LQ is disposed so that it is capable ofcontacting the liquid LQ in, for example, one of the followinglocations: in the vicinity of the liquid supply ports 37; in one of thepassageways 40A; in the passageway 40B; in the vicinity of the liquidrecovery port 8; in the passageway 42A; and in the passageway 42B. Thecontrol apparatus 3 uses that temperature sensor to detect thetemperature of the liquid LQ in the immersion space LS during theexposures of the plurality of shot regions on the substrate P.

Based on the detection result of the temperature sensor, the controlapparatus 3 determines, for each of the shot regions, whether thetemperature of the liquid LQ during the exposure of the relevant shotregion was within a permissible range that is prescribed in advance. Inother words, the control apparatus 3 verifies, for each of the shotregions, whether the temperature of the liquid LQ during the exposurewas within the permissible range.

If the control apparatus 3 determines, based on the detection results ofthe temperature sensor, that at least one shot region was exposedthrough the liquid LQ at a temperature outside of the permissible range,then after the exposures of all shot regions on the substrate P arecomplete and before that exposed substrate P is unloaded from thesubstrate stage 2, the control apparatus 3 uses the output apparatus 3Dto output an error. If an error is output, then the control apparatus 3stops the operation of processing the substrate P and stands by untilthe temperature of the liquid LQ returns to within the permissiblerange. The control apparatus 3 uses the temperature sensor to monitorthe temperature of the liquid LQ during this standby time as well. Whenthe control apparatus 3 determines, based on the result of thetemperature sensor, that the temperature of the liquid LQ has returnedto within the permissible range, the control apparatus 3 resumes theoperation of processing the substrate P.

Furthermore, the control apparatus 3 can also stop (interrupt) theoperation of processing the substrate P at the point in time itdetermines that the temperature of the liquid LQ during the exposure ofthat substrate P is outside of the permissible range.

In the present embodiment, the control apparatus 3 uses the first driveapparatus 11 and the second drive apparatus 12 to drive the first member7 or the second member 9, or both, in accordance with the supplyconditions of the liquid LQ to adjust at least one of the following: thepositional relationship between the lower surface 6 and the frontsurface of the substrate P in the Z axial directions; and the positionalrelationship between the liquid recovery port 8 (i.e., the liquidrecovery surface 30) and the front surface of the substrate P in the Zaxial directions. Furthermore, either the lower surface 6 or the liquidrecovery port 8 (i.e., the liquid recovery surface 30) may be moved inaccordance with the supply conditions of the liquid LQ; furthermore,both the lower surface 6 and the liquid recovery surface 30 may bemoved. In addition, both the lower surface 6 and the liquid recoveryport 8 (i.e., the liquid recovery surface 30) may be moved in the samedirection (the +Z axial direction or the −Z axial direction) inaccordance with the supply conditions of the liquid LQ; furthermore, thelower surface 6 and the liquid recovery surface 30 may be moved inopposite directions. In addition, if the lower surface 6 or the liquidrecovery port 8 (i.e., the liquid recovery surface 30), or both, aremoved in accordance with the supply conditions of the liquid LQ, thenthe relative position between the lower surface 6 and the liquidrecovery port 8 (i.e., the liquid recovery surface 30) may change, ormay not change.

The adjustment of the positional relationship between the lower surface6 and the front surface of the substrate P in the Z axial directionsincludes the adjustment of the distance A between the lower surface 6and the front surface of the substrate P in the Z axial directions. Inaddition, the adjustment of the positional relationship between theliquid recovery port 8 (i.e., the liquid recovery surface 30) and thefront surface of the substrate P in the Z axial directions includes theadjustment of the distance B between the liquid recovery port 8 (i.e.,the liquid recovery surface 30) and the front surface of the substrate Pin the Z axial directions. In addition, the adjustment of the distance Abetween the lower surface 6 and the front surface of the substrate Pincludes the adjustment of the distance C between the emergent surface 5and the lower surface 6, and the adjustment of the distance B betweenthe liquid recovery port 8 (i.e., the liquid recovery surface 30) andthe front surface of the substrate P includes the adjustment of thedistance D between the emergent surface 5 and the liquid recovery port 8(i.e., the liquid recovery surface 30).

In the present embodiment, the first drive apparatus 11 comprises ameasuring apparatus {not shown), which comprises an encoder systemcapable of measuring the amount of drive generated by the drivemechanisms 11A in the Z axial directions. The measuring apparatus iscapable of measuring the amount of movement of the connecting members11B, which are connected to the first member 7 and are driven by thedrive mechanisms 11 A. The measuring apparatus is also capable ofmeasuring the amount of movement of the connecting members 11B (thefirst member 7) with respect to a prescribed reference position in the Zaxial directions. In the present embodiment, for example, the emergentsurface 5 of the last optical element 4 is used as this referenceposition. The measuring apparatus measures the amount of movement of thefirst member 7 with respect to the emergent surface 5 of the lastoptical element 4 in the Z axial directions. The encoder system of themeasuring apparatus comprises a scale member and an encoder head thatdetects a scale {a grating) on that scale member; in addition, theposition of the scale member or the encoder head, or both, is fixed. Thescale member or the encoder head, or both, is disposed in a fixedmember, the position of which is fixed, such as the first base plate 15.Accordingly, the encoder system can detect the position (the amount ofmovement) of the first member 7 with respect to that fixed member. Inaddition, the projection optical system PL, which comprises the lastoptical element 4, is supported by the first base plate 15, the positionof which is fixed. Accordingly, the measuring apparatus can derive boththe amount of movement of the first member 7, using the emergent surface5 as the reference position, as well as the position of the lowersurface 6 of the first member 7 with respect to the emergent surface 5.

In the present embodiment, the first drive apparatus 11 adjusts theposition of the lower surface 6 with respect to the emergent surface 5in the Z axial directions based on the measurement result of themeasuring apparatus; namely, the first drive apparatus 11 adjusts thedistance C between the emergent surface 5 and the lower surface 6 andadjusts the distance A between the lower surface 6 and the front surfaceof the substrate P

Similar to the first drive apparatus 11, the second drive apparatus 12comprises a measuring apparatus (not shown) that is capable of measuringthe amount of drive of the drive mechanism 12A in the Z axialdirections. The measuring apparatus is capable of measuring the amountof movement of the connecting member 12B, which is connected to thesecond member 9. The measuring apparatus measures the amount of movementof the second member 9 in the Z axial directions using the emergentsurface 5 of the last optical element 4 as a reference position.

In the present embodiment, the second drive apparatus 12 adjusts theposition of the liquid recovery port 8 (i.e., the liquid recoverysurface 30) with respect to the emergent surface 5 in the Z axialdirections based on the measurement result of the measuring apparatus;namely, the second drive apparatus 12 adjusts the distance D between theemergent surface 5 and the liquid recovery port 8 (i.e., the liquidrecovery surface 30) and adjusts the distance B between the liquidrecovery port 8 (i.e., the liquid recovery surface 30) and the frontsurface of the substrate P.

The supply conditions of the liquid LQ that fills the optical path K ofthe exposure light EL include the amount of the liquid LQ supplied perunit of time to the optical path K. In the present embodiment, thesupply conditions of the liquid LQ also include the selected mode,namely the first mode or the second mode discussed above.

If one desires, for example, to decrease the amount of the liquid LQsupplied per unit of time from the liquid supply ports 37, namely if thefirst mode is set, then the control apparatus 3 moves the first member 7or the second member 9, or both, in the Z axial directions so that thedistance F between the lower surface 6 of the first member 7 and thefirst liquid recovery surface 31 is greater than the initial distanceF₀. In the present embodiment, the second member 9 is moved in the +Zdirection as shown in FIG. 6. Namely, the second member 9 is moved inthe +Z direction so that the distance B between the first liquidrecovery surface 31 and the substrate P is greater than the initialdistance B₀. If the substrate P is moved in the −Y direction withrespect to the last optical element 4 as shown in FIG. 6, then theliquid LQ in the vicinity of the step 35 tends not to flow in the −Ydirection. Moving the substrate P in the −Y direction impedes any flowof the liquid LQ in the −Y direction that would be otherwise generatedbetween the lower surface 6 and the front surface of the substrate P asa result of the pressure loss at the step 35 (between the first liquidrecovery surface 31 and the front surface of the substrate P). When thesubstrate P is moved in the −Y direction, a flow (a vortex) of theliquid LQ is created, as shown by an arrow R1 in FIG. 6, in the vicinityof the step 35, thereby preventing the interface LG of the liquid LQfrom moving in the −Y direction. Increasing the size of the distance B,and thereby increasing the size of the step 35 (the distance F), moreeffectively prevents the interface LG of the liquid LQ from moving inthe −Y direction. As a result, the position of the surface (i.e., theair-liquid interface or the meniscus) of the liquid LQ in the Z axialdirections within the gap G1 is prevented from moving in the −Zdirection (i.e., the water level is prevented from falling).Accordingly, the surface of the liquid LQ within the gap G1 can bemaintained at a high position.

If the amount of the liquid LQ supplied per unit of time from the liquidsupply ports 37 is small and the interface LG of the liquid LQ moves along distance, then, attendant with that movement of the interface LG,the position of the surface of the liquid LQ in the Z axial directionswithin the gap G1 will tend to move in the −Z direction. Namely, thelevel (the water level) of the liquid LQ within the gap G1 will tend todescend. As a result, the gap G1 may become filled with a gas, andbubbles or voids, or both, may mix with the liquid LQ between the lastoptical element 4 and the substrate P.

According to the present embodiment, if one desires to reduce the amountof the liquid LQ supplied per unit of time from the liquid supply ports37, then the intermixing of bubbles or voids, or both, in the liquid LQcan be prevented by increasing the size of the step 35 (i.e., thedistance F).

Furthermore, in the example shown in FIG. 6, the distance F (i.e., thestep 35) is increased by the movement of the second member 9 in the +Zdirection; however, as shown in FIG. 7, the first member 7 may insteadbe lowered in the −Z direction. As discussed above, if the amount of theliquid LQ supplied per unit of time from the liquid supply ports 37 issmall, then the position of the surface of the liquid LQ within the gapG1 tends to move in the −Z direction; however, making the distance Asmaller than the initial distance A₀ increases the loss of pressurebetween the lower surface 6 of the first member 7 and the front surfaceof the substrate P and, in turn, prevents the movement of the interfaceLG of the liquid LQ much more effectively. Accordingly, the level of theliquid LQ within the gap G1 is prevented from descending, which makes itpossible to maintain the surface of the liquid LQ at a high position. Ifthe first member 7 is moved in the −Z direction, then the distance Fbecomes greater than the initial distance F₀; consequently, the secondmember 9 does not have to be moved as shown in FIG. 7, or the secondmember 9 may be moved in the −Z direction or in the +Z direction, whichis the opposite direction to the direction of movement of the firstmember 7.

Furthermore, if the first mode is set, then by merely lowering the firstmember 7 and thereby making the distance A smaller than the initialdistance A₀, the distance F becomes larger than the initial distance F₀and no further action is required to increase the size of the distanceF. Namely, the distance A may be made substantially the same as thedistance B2 or smaller than the distance B2.

In addition, if one desires, for example, to increase the amount of theliquid LQ supplied per unit of time from the liquid supply ports 37,namely if the second mode is set, then, as shown in FIG. 8, the controlapparatus 3 moves the first member 7 in the +Z direction so that thedistance A between the lower surface 6 and the front surface of thesubstrate P is greater than the initial distance A₀. If the amount ofthe liquid LQ supplied per unit of time from the liquid supply ports 37has been increased in the state wherein the distance A is small, namelyin the state wherein the space between the lower surface 6 and the frontsurface of the substrate P is small, then, for example, the position ofthe surface of the liquid LQ within the gap G1 might move in the +Zdirection (i.e., the air-liquid interface may rise), thereby causing theliquid LQ to overflow the upper end of the gap G1.

According to the present embodiment, if the second mode is set, then theliquid LQ can be prevented from overflowing the gap G1 by moving thefirst member 7 in the +Z direction so that the pressure loss between thelower surface 6 and the front surface of the substrate P decreases. Inaddition, moving the first member 7 in the +Z direction makes thedistance F smaller than the initial distance F₀, which reduces thepressure loss at the step 35; furthermore, attendant with the movementof the substrate P in the −Y axial direction, the interface LG of theliquid LQ tends to move in the −Y direction. The level of the liquid LQin the gap G1 is thereby prevented from rising, and, in turn, the liquidLQ can be prevented from overflowing the upper end of the gap G1. Inaddition, because, in such a case, the gap G2 would also increase insize, at least part of the liquid LQ in the immersion space LS will tendto flow into the gap G2 when the substrate P moves; in this way, too,the liquid LQ can be prevented from overflowing the upper end of the gapG1.

Furthermore, in the example shown in FIG. 8, the first member 7 may bemoved in the +Z direction and the second member 9 may be lowered in the−Z direction. Namely, by lowering the second member 9 in the −Zdirection, the distance F may be further reduced. As discussed above, ifthe amount of the liquid LQ supplied per unit of time from the liquidsupply ports 37 is large, then the liquid LQ will tend to overflow theupper end of the gap G1; however, reducing the distance F in turnreduces the pressure loss at the step 35, which, in turn, can preventthe liquid LQ from overflowing the upper end of the gap G1. In addition,because the distance B2 between the third liquid recovery surface 33 andthe front surface of the substrate P decreases, namely because the thirdliquid recovery surface 33 approaches the front surface of the substrateP, any of the liquid LQ that has formed as a thin film or a droplet onthe substrate P can also be collected by the third liquid recoverysurface 33.

Furthermore, if the second mode is set, then, merely by raising thefirst member 7 and making the distance A larger than the initialdistance A₀, the distance F does not have to be made smaller than theinitial distance F₀.

In addition, if the second mode is set, then the first member 7 does nothave to be moved in the +Z direction, namely the distance C (and, inturn, the distance A) does not need to be modified from its initialstate as shown in FIG. 5, and it suffices merely to make the distance Fbetween the lower surface 6 of the first member 7 and the first liquidrecovery surface 31 of the second member 9 smaller than the initialdistance F₀, as shown in FIG. 9. In this case, the pressure loss at thestep 35 decreases, which makes it possible to prevent the liquid LQ fromflowing out of the upper end of the gap G1. In addition, because, inthis case, the distance B2 between the third liquid recovery surface 33and the front surface of the substrate P is smaller than the initialdistance B2 ₀, any of the liquid LQ that has formed as a thin film onthe substrate P can also be collected by the third recovery surface 33,as shown in FIG. 9.

Furthermore, with or without taking the supply conditions of the liquidLQ into consideration as discussed above, at least one of the followingmay be adjusted in accordance with the movement conditions of thesubstrate P: the positional relationship between the lower surface 6 andthe front surface of the substrate P in the Z axial directions; and thepositional relationship between the liquid recovery port 8 (i.e., theliquid recovery surface 30) and the front surface of the substrate P inthe Z axial directions. The movement conditions of the substrate Pinclude the movement velocities of the substrate P within the XY plane.The movement velocities of the substrate P within the XY plane include,for example, the movement velocity of the substrate P in the Y axialdirections during a scanning exposure and the movement velocity of thesubstrate P in the X axial directions (or in the directions inclinedwith respect to in the X axial directions within the XY plane) duringthe stepping operation. In addition, the movement conditions of thesubstrate P include linear distances of continuous movement of thesubstrate P in a prescribed direction within the XY plane. The lineardistances of continuous movement of the substrate P in the prescribeddirection within the XY plane include, for example, the linear distanceof continuous movement of the substrate P in the Y axial directionsduring the scanning exposure operation and the linear distance ofcontinuous movement of the substrate P in the X axial directions (or inthe directions inclined with respect to the X axial directions withinthe XY plane) during the stepping operation.

If, for example, the substrate P is moved at high speed in the −Ydirection with respect to the last optical element 4, or if thesubstrate P is moved linearly for a long distance in the −Y direction,then the control apparatus 3 moves the first member 7 and the secondmember 9 in the −Z direction; thereby, the distance C between theemergent surface 5 and the lower surface 6 is made larger than theinitial distance C₀, the distance A between the lower surface 6 and thefront surface of the substrate P is made smaller than the initialdistance A₀, and the distance B2 between the third liquid recoverysurface 33 and the front surface of the substrate P is made smaller thanthe initial distance B2 ₀. Thereby, the pressure loss between the lowersurface 6 and the front surface of the substrate P increases, whichmakes it possible to prevent the interface LG of the liquid LQ frommoving attendant with the movement of the substrate P. In addition,because the distance B2 between the third liquid recovery surface 33 andthe front surface of the substrate P is small, the liquid LQ on thesubstrate P forms, for example, a thin film or a droplet, and thisliquid LQ can also be collected by the third liquid recovery surface 33.Furthermore, the first member 7 and the second member 9 may be loweredsuch that the distance F between the lower surface 6 and the firstliquid recovery surface 31 becomes greater than the initial distance F₀.Thereby, the pressure loss owing to the step 35 between the lowersurface 6 and the first liquid recovery surface 31 increases, whichmakes it possible to more effectively prevent the interface LG of theliquid LQ from moving as the substrate P moves. Thus, by moving thefirst member 7 or the second member 9, or both, in the Z axialdirections in accordance with the movement conditions of the substrateP, the liquid LQ can be prevented from leaking out of the space betweenthe first member 7 and the second member 9 on one side and the substrateP on the other side, and the liquid LQ (i.e., the film, the droplet, orthe like of the liquid LQ) can be prevented from remaining on the frontsurface of the substrate P.

In addition, in the examples explained referencing FIG. 6 through FIG.9, the positions of the lower surface 6 and the liquid recovery surface30 are fixed during the exposure of a single substrate P; however, thelower surface 6 or the liquid recovery surface 30, or both, may move inthe Z axial directions during the exposure of a single substrate P. Forexample, because the movement conditions of the substrate P changeduring its exposure, the lower surface 6 or the liquid recovery surface30, or both, may move in the Z axial directions in accordance with thevarious movement conditions.

In addition, the distance A between the lower surface 6 and the frontsurface of the substrate P in the Z axial directions or the distance Bbetween the liquid recovery port 8 (i.e., the liquid recovery surface30) and the front surface of the substrate P, or both, may be adjustedby moving the first member 7 or the second member 9, or both, in the Zaxial directions in accordance with the distance E between the emergentsurface 5 of the last optical element 4 and the front surface of thesubstrate P in the Z axial directions.

For example, if the front surface of the substrate P is moved in the +Zdirection and the distance E decreases as shown in FIG. 10, then thecontrol apparatus 3 adjusts the positions of the lower surface 6 and theliquid recovery surface 30 so that the distance A between the lowersurface 6 and the front surface of the substrate P and the distance Bbetween the liquid recovery surface 30 and the front surface of thesubstrate P increase. Moving the front surface of the substrate P in the+Z direction and reducing the distance E, however, creates thepossibility that the lower surface 6 and the liquid recovery surface 30will contact the front surface of the substrate P. For example, thedistance E may decrease as a result of an operational error of thesubstrate stage 2 that holds the substrate P. By adjusting the positionsof the lower surface 6 and the liquid contact surface (liquid recoverysurface 30) in the Z axial directions in accordance with the distance E,however, the lower surface 6 or the liquid recovery surface 30, or both,can be prevented from contacting (colliding with) the substrate P. Inthe present embodiment, the position of the front surface of thesubstrate P is detected by the detection system 50, and therefore, thecontrol apparatus 3 can use the detection system 50 to detect theposition of the front surface of the substrate P and, based on thatdetection result, can adjust the position of the lower surface 6 or theliquid recovery surface 30, or both, and thereby prevent the lowersurface 6 and the liquid recovery surface 30 from contacting thesubstrate P—even if, for example, an operational error occurs in thesubstrate stage 2.

In addition, as a result of, for example, an operational error of thesubstrate stage 2, the front surface of the substrate P might move inthe −Z direction and thereby increase the distance E. In such a case,too, the control apparatus 3 can adjust the distance A between the lowersurface 6 and the front surface of the substrate P or the distance Bbetween the liquid recovery surface 30 and the front surface of thesubstrate P, or both, in accordance with the distance E. For example, ifthe front surface of the substrate P moves in the −Z direction and thedistance E thereby increases, then the control apparatus 3 moves thefirst member 7 and the second member 9 in the −Z direction so that thedistance A between the lower surface 6 and the front surface of thesubstrate P and the distance B between the liquid recovery surface 30and the front surface of the substrate P both decrease. Thereby, even ifthe front surface of the substrate P moves in the −Z direction, theposition of the lower surface 6 is adjusted so that the liquid LQ can besatisfactorily held between the lower surface 6 and the front surface ofthe substrate P and the position of the liquid recovery surface 30 isadjusted so that the liquid LQ on the substrate P can be satisfactorilyrecovered.

Furthermore, the examples explained referencing FIG. 6 through FIG. 10were for cases wherein the substrate P is disposed at the exposureposition; however, as discussed above, there are also cases wherein anobject other than the substrate P is disposed such that it opposes thelower surface of the first member 7 and the liquid recovery surface 30of the second member 9. For example, part (an upper surface 2T) of thesubstrate stage 2 may be disposed at a position at which it opposes thefirst member 7 and the second member 9. In this case, too, by adjustingthe position of the lower surface 6 or the liquid recovery surface 30,or both, in accordance with the movement conditions of the substratestage 2 or the supply conditions of the liquid LQ, or both, it ispossible to prevent the liquid LQ from leaking out, remaining behind,and the like. Furthermore, the position of the lower surface 6 or theliquid recovery surface 30, or both, may be modified to match the objectthat opposes the lower surface 6 and the liquid recovery surface 30. Forexample, if both the substrate P and the upper surface 2T of thesubstrate stage 2 oppose the lower surface 6 and the liquid recoverysurface 30, then the position of the lower surface 6 or the liquidrecovery surface 30, or both, may be different.

In addition, for example, a member that is thicker than the substrate Pmight be held by the substrate holding part 2H. Alternatively, a member(e.g., a measuring member) might be disposed on the upper surface 2T ofthe substrate stage 2 at a position that is higher than the frontsurface of the substrate P held by the substrate holding part 2H. Forexample, there are cases wherein a substrate type measuring member(e.g., a temperature sensor), which, while its outer diameter issubstantially the same as that of the substrate P, is thicker than thesubstrate P, is held by a substrate stage. The distance between thefront surface of such a member and the emergent surface 5 is smallerthan the initial distance E₀, and consequently the lower surface 6 orthe liquid recovery surface 30, or both, might contact the member. Insuch a case, too, by adjusting the positional relationship (thedistance) between the lower surface 6 and the front surface of themember or the positional relationship (the distance) between the liquidcontact surface (liquid recovery surface 30) and the front surface ofthe member, or both, in accordance with the distance between theemergent surface 5 and the front surface of the member in the Z axialdirections, the lower surface 6 or the liquid recovery surface 30, orboth, can be prevented from contacting (colliding with) the member. Thedetection system 50 can detect the position of the front surface of themember, and therefore the control apparatus 3 can move the lower surface6 or the liquid recovery surface 30, or both, based on the detectionresult of that detection system 50.

In addition, if the exposure apparatus EX is an exposure apparatus thatcomprises a moveable substrate stage, which holds the substrate P, and ameasurement stage, which does not hold the substrate to be exposed andwhereon various photoelectric sensors or a fiducial member wherein afiducial mark is formed, or both, are mounted, then the measurementstage is disposed at the exposure position, as disclosed in, forexample, U.S. Pat. No. 6,897,963. In this case, the lower surface 6 orthe liquid recovery surface 30, or both, can be moved in accordance withthe movement conditions of the measurement stage or the supplyconditions of the liquid LQ, or both.

Furthermore, when the lower surface 6 or the liquid recovery surface 30,or both, are moved in the Z axial directions, the control apparatus 3can move—based on the measurement results of the measuring apparatus ofthe first drive apparatus 11 and the measuring apparatus of the seconddrive apparatus 12—the first member 7 or the second member 9, or both,so that the last optical element 4 and the first member 7 are preventedfrom contacting one another, and the first member 7 and the secondmember 9 are prevented from contacting one another.

Furthermore, in the embodiments discussed above, the immersion systemcomprises both the first drive apparatus 11 and the second driveapparatus 12, but it may comprise just one of these, as long as therelative positional relationship between the lower surface 6 of thefirst member 7 and the first liquid recovery surface 31 of the secondmember 9, namely the distance F (the size of the step 35) between thelower surface 6 and the first liquid recovery surface 31, in the Z axialdirections is adjusted.

In addition, in the embodiments discussed above, a configuration isadopted wherein two members (the first member 7 and the second member 9)can be moved independently in the Z axial directions, but aconfiguration may be adopted wherein three or more members can be movedindependently in the Z axial directions. For example, a configurationmay be adopted wherein rather than providing the third liquid recoverysurface 33 to the second member 9, a third member is provided that isdifferent from the second member 9, and the first member 7, the secondmember 9, and the third member can be moved independently in the Z axialdirections.

In addition, in each of the embodiments discussed above, a configurationmay be adopted wherein the first member 7 or the second member 9, orboth, can move parallel to the XY plane.

In addition, in the embodiments discussed above, “shaped annular” canalso include various shapes, such as a rectangular annular shape, acircular ring shape, and a polygonal annular shape.

As explained above, the present embodiment, by preventing the liquid LQfrom becoming entrained with bubbles, leaking out, or remaining behind,can prevent exposure failures from occurring. In addition, the travelspeed of the substrate P can be increased while at the same timepreventing exposure failures from occurring. Accordingly, satisfactorydevices can be fabricated with good productivity.

Furthermore, in the embodiments discussed above, the optical path K onthe emergent (image plane) side of the last optical element 4 of theprojection optical system PL is filled with the liquid LQ; however, itis possible to use a projection optical system PL wherein the opticalpath on the incident (object plane) side of the last optical element 4is also filled with the liquid LQ as disclosed in, for example, PCTInternational Publication No. WO2004/019128.

Furthermore, in each of the embodiments discussed above, water is usedas the liquid LQ, but a liquid other than water may be used. Forexample, it is also possible to use hydro-fluoro-ether (HFE),perfluorinated polyether (PFPE), Fomblin oil, or the like as the liquidLQ.

Furthermore, the substrate P in the embodiments discussed above is notlimited to a semiconductor wafer for fabricating semiconductor devices,but can also be adapted to, for example, a glass substrate for displaydevices, a ceramic wafer for thin film magnetic heads, or the originalplate of a mask or a reticle (synthetic quartz or a silicon wafer) thatis used by an exposure apparatus.

The exposure apparatus EX can also be adapted to a step-and-scan typescanning exposure apparatus (a scanning stepper) that scans and exposesthe pattern of the mask M by synchronously moving the mask M and thesubstrate P, as well as to a step-and-repeat type projection exposureapparatus (a stepper) that successively steps the substrate P andperforms a full field exposure of the pattern of the mask M with themask M and the substrate P in a stationary state.

Furthermore, when performing an exposure with a step-and-repeat system,the projection optical system PL is used to transfer a reduced image ofa first pattern onto the substrate P in a state wherein the firstpattern and the substrate P are substantially stationary, after whichthe projection optical system PL may be used to perform a full-fieldexposure of the substrate P, wherein a reduced image of a second patternpartially superposes the transferred first pattern in a state whereinthe second pattern and the substrate P are substantially stationary (asin a stitching type full-field exposure apparatus). In addition, thestitching type exposure apparatus can also be adapted to astep-and-stitch type exposure apparatus that successively steps thesubstrate P and transfers at least two patterns onto the substrate P sothat they are partially superposed.

In addition, the present invention can also be adapted to, for example,an exposure apparatus that combines on a substrate the patterns of twomasks through a projection optical system and double exposes,substantially simultaneously, a single shot region on the substrateusing a single scanning exposure, as disclosed in, for example, U.S.Pat. No. 6,611,316. In addition, the present invention can also beadapted to, for example, a proximity type exposure apparatus and amirror projection aligner. In addition, the present invention can alsobe adapted to a twin stage type exposure apparatus, which comprises aplurality of substrate stages, as disclosed in, for example, U.S. Pat.Nos. 6,341,007, 6,208,407, and 6,262,796.

The type of exposure apparatus EX is not limited to a semiconductordevice fabrication exposure apparatus that exposes the substrate P withthe pattern of a semiconductor device, but can also be widely adapted toexposure apparatuses that are used for fabricating, for example, liquidcrystal devices or displays, and to exposure apparatuses that are usedfor fabricating thin film magnetic heads, image capturing devices(CCDs), micromachines, MEMS devices, DNA chips, or reticles and masks.

Furthermore, in each of the embodiments discussed above, the positionsof the mask stage 1 and the substrate stage 2 are measured using aninterferometer system that comprises laser interferometers, but thepresent invention is not limited thereto; for example, an encoder systemmay be used that detects a scale (diffraction grating) provided to eachof the stages 1, 2. In this case, a hybrid system that comprises boththe interferometer system and the encoder system may also be adopted.

In addition, in each of the embodiments discussed above, an ArF excimerlaser may be used as a light source apparatus that generates ArF excimerlaser light, which serves as the exposure light EL; however, asdisclosed in, for example, U.S. Pat. No. 7,023,610, a harmonicgeneration apparatus may be used that outputs pulsed light with awavelength of 193 nm and that comprises: an optical amplifier part,which has a solid state laser light source (such as a DFB semiconductorlaser or a fiber laser), a fiber amplifier, and the like; and awavelength converting part. Moreover, in the abovementioned embodiments,both the illumination region IR and the projection region PR arerectangular, but they may be some other shape, for example, arcuate.

Furthermore, in each of the embodiments discussed above, an opticallytransmissive mask is used wherein a prescribed shielding pattern (orphase pattern or dimming pattern) is formed on an optically transmissivesubstrate; however, instead of such a mask, a variable pattern formingmask (also called an electronic mask, an active mask, or an imagegenerator), wherein a transmissive pattern, a reflective pattern, or alight emitting pattern is formed based on electronic data of the patternto be exposed, may be used as disclosed in, for example, U.S. Pat. No.6,778,257. The variable pattern forming mask comprises a digitalmicromirror device (DMD), which is one kind of a non-emissive type imagedisplay device (spatial light modulator). In addition, instead of avariable pattern forming mask that comprises a non-emissive type imagedisplay device, a pattern forming apparatus that comprises a selfluminous type image display device may be provided. Examples of a selfluminous type image display device include a cathode ray tube (CRT), aninorganic electroluminescence display, an organic electroluminescencedisplay (OLED: organic light emitting diode), an LED display, a laserdiode (LD) display, a field emission display (FED), and a plasma displaypanel (PDP).

Each of the embodiments discussed above explained an exemplary case ofan exposure apparatus that comprises the projection optical system PL,but the present invention can be adapted to an exposure apparatus and anexposing method that do not use the projection optical system PL. Thus,even if the projection optical system PL is not used, the exposure lightcan be radiated to the substrate P through optical members, such aslenses, and an immersion space can be formed in a prescribed spacebetween the substrate P and those optical members.

In addition, by forming interference fringes on the substrate P asdisclosed in, for example, PCT International Publication No.WO2001/035168, the present invention can also be adapted to an exposureapparatus (a lithographic system) that exposes the substrate P with aline-and-space pattern.

As described above, the exposure apparatus EX of the present embodimentis manufactured by assembling various subsystems, as well as eachconstituent element, so that prescribed mechanical, electrical, andoptical accuracies are maintained. To ensure these various accuracies,adjustments are performed before and after this assembly, including anadjustment to achieve optical accuracy for the various optical systems,an adjustment to achieve mechanical accuracy for the various mechanicalsystems, and an adjustment to achieve electrical accuracy for thevarious electrical systems. The process of assembling the exposureapparatus EX from the various subsystems includes, for example, themechanical interconnection of the various subsystems, the wiring andconnection of electrical circuits, and the piping and connection of theatmospheric pressure circuit. Naturally, prior to performing the processof assembling the exposure apparatus EX from these various subsystems,there are also the processes of assembling each individual subsystem.When the process of assembling the exposure apparatus EX from thevarious subsystems is complete, a comprehensive adjustment is performedto ensure the various accuracies of the exposure apparatus EX as awhole. Furthermore, it is preferable to manufacture the exposureapparatus EX in a clean room wherein, for example, the temperature andthe cleanliness level are controlled.

As shown in FIG. 11, a micro-device, such as a semiconductor device, ismanufactured by: a step 201 that designs the functions and performanceof the micro-device; a step 202 that fabricates a mask (a reticle) basedon this designing step; a step 203 that manufactures a substrate, whichis the base material of the device; a substrate processing step 204 thatcomprises a substrate process (exposure process) that includes, inaccordance with the embodiments discussed above, exposing the substratewith the exposure light using the mask pattern and developing theexposed substrate; a device assembling step 205 (which includesfabrication processes such as dicing, bonding, and packaging processes);an inspecting step 206; and the like.

Furthermore, the features of each of the embodiments discussed above canbe appropriately combined. There can also be cases wherein some of theconstituent elements are not used. In addition, each disclosure of everypatent publication and U.S. patent related to the exposure apparatusrecited in each of the embodiments, modified examples, and the likediscussed above is hereby incorporated by reference in its entirety tothe extent permitted by the national laws and regulations designated bythe present application.

1. A liquid immersion exposure apparatus, comprising: a projectionsystem; a first member that has a liquid supply port, the first memberhaving an opening disposed below a final surface of the projectionsystem and exposure light being projected via the opening,; a secondmember that has a liquid recovery port; a first drive apparatus thatmoves the first member; and a second drive apparatus that moves thesecond member, wherein: a substrate is moves below the projectionsystem, the first member and the second member during exposureoperation, the substrate is exposed by projecting the exposure light viathe opening of the first member to an upper surface of the substratethrough liquid during the exposure operation, the recovery port collectsliquid on the upper surface of substrate during the exposure operation,and a relative position of the first member and the second member isadjustable by moving the first member using the first drive apparatus,the second member using the second drive apparatus, or both of the firstand second members using the first and second drive apparatus.
 2. Theapparatus of claim 1, wherein: the first member has a first surfacefacing downwardly, the second member has a second surface which facesupwardly and is disposed under the first surface of the first member,and a gap is formed between the first surface of the first member andthe second surface of the second member.